双语科技快报 | 2026-08-10 | 21:40 速览

## 1. Sources: Microsoft plans to unveil its next-gen Maia 300 AI chip this fall, potentially as soon as September, and is negotiating with TSMC to make 300K+ in 2027

来源: The Information

时间: 9:15 AM

消息人士称，微软计划于今年秋季发布其下一代Maia 300人工智能芯片，最早可能于9月亮相，并正与台积电洽谈2027年生产超过30万颗芯片的事宜。

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