双语科技快报 | 2026-07-16 | 07:41 速览

1. Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users

来源: Marco Chiappetta / Forbes

时间: 7:25 PM

Cadence推出AuraStack AI超级代理，一个面向PCB和先进芯片封装设计的AI平台，Nvidia、台积电和施耐德电气成为首批用户

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