双语科技快报 | 2026-07-13 | 13:00 速览

1. A Taiwanese minister says TSMC plans two more advanced chip packaging plants in Chiayi Science Park, with all four expected to generate $9.35B+ in annual output

来源: Wen-Yee Lee / Reuters

时间: 12:45 AM

一位台湾官员表示，台积电（TSMC）计划在嘉义科学园区新建两座更先进的芯片封装工厂，届时所有四座工厂的年度总产出预计将达到93.5亿美元以上。

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